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SpatialNews Press Release
Infineon and Trimble Introduce
Smallest and Lowest Power GPS Solution for Mobile, Automotive and
Consumer Applications
MUNICH, Germany, Oct. 25, 2000--Infineon Technologies
(FSE:IFX)(NYSE:IFX) and Trimble (Nasdaq:TRMB) today announced the smallest and lowest power
integrated chipset and software solution for Global Positioning System (GPS) applications. The solution,
based on Trimble's FirstGPS(TM) technology, allows high-volume manufacturers of consumer products
to add GPS location with minimal impact on device size or battery life.
"Our combined efforts continue to lay the foundation for future generations of location-aware and
communication-enabled consumer applications," said Steven W. Berglund, president and CEO of
Trimble. "Infineon is a major player in several critical communication markets, such as GSM for the
handset market. As the telematics market continues to emerge, the ability to combine Trimble GPS
location and Infineon communication technologies at the integrated circuit and firmware levels will
become even more important to the automotive industry."
"By combining our respective strengths, we can drive development in the GPS mass market," says
Dr. Hermann Eul, general manager and vice president of the baseband ICs business unit at Infineon.
"Our chipset is a vital part of this highly-integrated solution for high-volume, cost-effective GPS
applications. This innovative hardware and software solution makes it possible to equip an even wider
range of mobile devices with GPS functionality. We feel that the very small chip size and the ultra-low
power consumption make our solution ideal for a range of applications, specifically mobile phone
applications."
About the Product
The jointly developed 12-channel chipset and software solution is specifically designed for
power-sensitive, wireless enabled, mobile information devices such as laptops, PDAs, digital cameras,
smart phones, pagers and automobile navigation systems.
The technology offers the lowest power consumption of any GPS receiver on the market today. The
chipset is comprised of one baseband ASIC and one RF ASIC. The baseband ASIC consumes less than
8 milliwatts and the RF ASIC less than 20 milliwatts. It is ideal for power-sensitive applications. For
devices that only need location-on-demand, several sleep and low-power modes allow for further power
savings and longer battery life. FirstGPS technology is also communication independent and capable of
interfacing with a wide range of devices including AMPS, CDMA, TDMA, GSM, 3G, CDPD and
others.
Infineon's implementation of the baseband and RF ASICs is extremely compact. The baseband chip is
packed in a 28-pin TSSOP (9.7mm x 6.4mm) and the RF chip in a 24-pin TSSOP (7.9mm x 6.4mm).
The high level of integration translates to lower component count and enables a tiny footprint that is
approximately one-sixth of a square inch for the entire chipset solution. This tiny footprint facilitates the
integration of GPS functionality into a variety of mobile devices without adversely affecting product form
factor and size.
Availability
Infineon's FirstGPS chipset is planned to be available in the fourth quarter of 2000.
About Trimble
Founded in 1978, Trimble is a recognized worldwide leader in the development of innovative Global
Positioning System (GPS) technology-based products for a wide range of applications.
Today, these advanced solutions combine GPS with wireless communications and sophisticated
software to meet demanding applications in markets ranging from agriculture and construction to asset
management, automotive and timing. Headquartered in Sunnyvale, CA, Trimble provides end-users and
OEMs with leading edge solutions backed by global leadership in innovation, exceptional experience and
in depth applications knowledge as well as a reputation for excellence.
With its acquisition of Spectra Precision, a leading provider of construction lasers, machine control
systems, optical surveying instruments and related software, Trimble now broadens its portfolio of
positioning solutions for the engineering and construction, and agriculture markets.
For an interactive look at company news and products, visit Trimble's Web site at
http://www.trimble.com and Spectra Precision at http://www.spectraprecision.com
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor solutions for applications in the
wireless and wired communications markets, for the automotive and industrial sectors, for security
systems and chip cards as well as memory products. With a global presence, Infineon operates in the
US from San Jose, CA, and in the Asia-Pacific region from Singapore. In the fiscal year 1999 (ending
September), the company achieved sales of Euro 4.24 billion (US $ 4.51 billion) with about 26,000
employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the
New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com
CONTACT:
Trimble
Lea Ann McNabb, 408/481-7808
leaann_mcnabb@trimble.com
or
Infineon Technologies
Worldwide Headquarters:
Gunter Gaugler, +49 89 234 28481
guenter.gaugler@infineon.com
or
U.S.A.:
Toni Goodrich, 408/501-6382
Toni.goodrich@infineon.com
or
Asia:
Kaye Lim, +65 8400 689
kaye.lim@infineon.com
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